Electrical and Computer Engineering Events

Title: Wearable Technology for Healthcare and Athletic Performance

Abstract: In the future, wearable technology will provide a continuous, autonomous, and comprehensive assessment of a person’s health. This future presents a tremendous opportunity for the development of new wearable devices that will support predictive analytics and personalized medicine. On the hardware side, we are liberating sensors from the bench top in the clinical lab and introducing them into the wild. Most commonly, smartwatches provide sensors that enable vital sign monitoring, such as heart rate and pulse oximetry. However, many of the most powerful sensing techniques are still limited to the benchtop. In this talk, I will introduce my recent work on developing a wearable optical spectroscopy device for non-invasive health monitoring. I will discuss the challenges of redesigning traditional spectroscopic methods to overcome the resource constraints of a wearable device and facilitate the adaptation to dynamically changing environments. Further, I will explore how this device can be used to continuously monitor biomarkers such as glucose or opioids. Finally, I will discuss my vision for the future; enabling a future where everyone has a comprehensive understanding of their own health at their fingertips.

UVA Link Lab 2023 Research Day will be held on October 11, 2023 at Darden School of Business.

Title: Bridging the Gap in Prediction, Optimization, and Control of Integrated Dynamic Systems

Abstract: Integrated systems are ubiquitous as more heterogeneous physical entities are combined to form functional platforms. With increased connectivity, new and “invisible” feedback loops and physical couplings are introduced, leading to emerging dynamics and making the integrated systems more control-intensive. The multi-physics, multi-time scale, and distributed-actuation natures of integrated systems present new challenges for modeling and control. Understanding their operating environments, achieving sustained high performance, and incorporating rich but incomplete data also motivate the development of novel design tools and frameworks.

Sung-Kyu Lim

Professor, Georgia Institute of Technology​​ 

Title: Micro-bumping vs. Hybrid Bonding: 3D IC Performance and Reliability Comparisons

Yoshiaki Nakamura

Professor, Osaka University, Japan

Title: Nanostructure design and fabrication for high performance thermoelectric material

Christopher Nordquist

Sandia National Lab​ 

Title: Heterogeneous Integration for Next-Generation RF Microsystems

Abstract: