Sung-Kyu Lim
Professor, Georgia Institute of Technology
Title: Micro-bumping vs. Hybrid Bonding: 3D IC Performance and Reliability Comparisons
Abstract: Two of the most popular technologies being actively adopted by the semiconductor industry for 3D heterogenous integration are micro-bumping and hybrid bonding. In this talk, we quantify and compare the power, performance, and area (PPA) of 3D ICs built with these two bonding technologies. We use the pitch values that represent the current and the future of these options. Our studies are based on commercial quality full-chip GDS layouts and sign-off PPA analysis of commercial processor architectures designed with commercial process development kits (PDK). We analyze the impact of 3D interconnects enabled by micro-bumps and hybrid bond pads at various pitches on full-chip critical path delay, memory latency, and power consumption. In addition, we investigate the power delivery and thermal issues in these bonding technologies and develop solutions to mitigate the associated reliability issues. We also discuss the commercial-quality RTL-to-GDS tools developed to enable these studies.
Biography:
Prof. Sung Kyu Lim received Ph.D. degree from UCLA in 2000. He joined the School of Electrical and Computer Engineering at the Georgia Institute of Technology in 2001, where he is currently Motorola Solutions Foundation Professor. His research focuses on the architecture, design, and electronic design automation for 2D, 2.5D, and 3D ICs using conventional and AI algorithms. He has published more than 400 papers on the topics. He received the Best Paper Award from the IEEE Transactions on CAD in 2022 and the ACM Design Automation Conference in 2023. He began serving as a program manager for DARPA Microsystems Technology Office (MTO) since 2022 to create and manage programs in 3D IC design automation. He is an IEEE fellow.
Host: Dr. Kyusang Lee
Organizer: Dr. Mona Zebarjadi