B.S. ​Rensselaer Polytechnic Institute, 1979M.S. ​​Rensselaer Polytechnic Institute, 1980Ph.D. ​Stanford University, 1987

Michael Reed is currently on leave from UVA, serving as Associate Vice President of Westlake University in Hangzhou, China. He has held appointments at Hewlett-Packard Laboratories, Carnegie-Mellon University, University of Twente, ETH Zürich, and the Albert Ludwigs Universität, Freiburg. Professor Reed’s research interests center around micro- and nanofabrication technologies, and microsystems applications. He was the Technical Chairman of the 1995 IEEE International Workshop on MEMS, and the General Chairman of the 1996 Workshop. He was a founder of Setagon, Inc., a biomedical device startup company developing microfabricated drug and gene delivery systems which was acquired by Medtronic in 2007. He holds 17 issued patents related to microsystems technology and microfabricated medical devices. He is the author of the textbook Applied Introductory Circuit Analysis for Electrical and Computer Engineers and approximately 130 research publications. Professor Reed received the Hertz Foundation Prize and a Presidential Young Investigator Award, and is a National Distinguished Expert of the Chinese Thousand Talent Plan, and a Fellow of the Institute of Physics.


  • Thousand Talent Scholar 2017
  • Fellow, Institute of Physics 1999
  • UVA ECE Faculty Educational Innovation Award 2002
  • UVA School of Engineering and Applied Science Harold S. Morton, Jr. Teaching Prize 2000
  • NSF Presidential Young Investigator 1989
  • Hertz Foundation Thesis Prize 1988
  • Hertz Fellow 1983 - 1987

Research Interests

  • Materials and Advanced Manufacturing for Biological Applications
  • Surface and Interface Science and Engineering
  • Nanomaterials and nanomanufacturing

Selected Publications

  • “Micromechanical Velcro,” IEEE Journal of Microelectromechanical Systems 1(1), 37 - 43, 1992. H. Han, L. E. Weiss, M. L. Reed
  • “Effects of Elevated Temperature Treatments in Microstructure Release Procedures,” IEEE Journal of Microelectromechanical Systems, 4(2), 66 - 75, 1995. T. Abe, W. C. Messner, M. L. Reed
  • “Laminated High-Aspect-Ratio Microstructures Fabricated in a Conventional CMOS Process,” Sensors and Actuators A 57, 103 - 110, 1996. G. K. Fedder, S. Santhanam, M. L. Reed, S. C. Eagle, D. F. Guillou, M. S.-C. Lu, L. R. Carley
  • “Microsystems for Drug and Gene Delivery,” (invited), Proceedings of the IEEE 92(1), 56 - 75, 2004. M. L. Reed, W. K. Lye
  • “Mitigation of tensile failure in released nanoporous metal microstructures via thermal treatment,” Applied Physics Letters 89, 133104, 2006. J. Zhu, E. Seker, H. Bart-Smith, M. R. Begley, R. G. Kelly, G. Zangari, W.-K. Lye, M. L. Reed
  • “Wetting phenomenon in nanoporous gold films,” Electrochemical Society Transactions 6(11), 83-89, 2007. E. Seker, T. Tauer, J. Zhu, M. Begley, H. Bart-Smith, G. Zangari, R. Kelly, M. Utz, M. L. Reed
  • “Kinetics of capillary wetting in nanoporous films in the presence of surface evaporation,” Applied Physics Letters 92, 013128, 2008. E. Seker, M. R. Begley, M. L. Reed, M. Utz
  • “Three-phase contact force equilibrium of liquid drops at superhydrophilic and superhydrophobic surfaces,” Journal of Colloid and Interface Science 404, (2013) 179–182. ABS J. Zhu, G. Zangari, M. L. Reed
  • “Interrogation of Droplet Configuration during Electrowetting via Impedance Spectroscopy,” IEEE Journal of Microelectromechanical Systems 24(6) (2015), 2092-2100. ABS X. Hu, M. Mibus, G. Zangari, C. Knospe, M. L. Reed
  • Applied Introductory Circuit Analysis for Electrical and Computer Engineers, ISBN 0-13-787631-9, Prentice-Hall, 1998. M. L. Reed, R. A. Rohrer

Courses Taught

  • ENGR 1620 Introduction to Engineering
  • ECE 2066 Science of Information
  • ECE 2630 Introductory Circuit Analysis
  • ECE 2660 Electronics I
  • ECE 3430 Introduction to Embedded Computer Systems
  • ECE 5150 Microelectronic Integrated Circuit Fabrication
  • ECE 587 Microsystem Design
  • ECE 6155 Microelectronic Integrated Circuit Fabrication Laboratory