Robert E. West III launched a new version of HotSpot on Github. The new version 7.0 implements the microfluidic cooling feature into the HotSpot simulator. The new feature is expected to broaden the thermal management options whilst designing 3D microarchitecture.
What is HotSpot?
HotSpot is an accurate and fast thermal model suitable for use in architectural studies. It is based on an equivalent circuit of thermal resistances and capacitances that correspond to microarchitecture blocks and essential aspects of the thermal package. The model has been validated using finite element simulation. HotSpot has a simple set of interfaces and hence can be integrated with most power-performance simulators like Wattch. The chief advantage of HotSpot is that it is compatible with the kinds of power/performance models used in the computer-architecture community, requiring no detailed design or synthesis description. HotSpot makes it possible to study thermal evolution over long periods of real, full-length applications.