Jun-Han Han brings the award of "University Demo Best Demonstration, Honorable Mention" with his demonstration of "HotSpot 7.0: An enhanced Compact Thermal modeling for 3DIC cooling solution exploration" from The 31st ACM SIGDA University Demonstration at DAC 2021 (UBooth@DAC). HotSpot 7.0 is the last version of the HotSpot thermal modeling and simulation tool developed by Jun-Han Han, Robert E. West, Xinfei Guo, Kevin Skadron, and Mircea Stan.