Mircea R. Stan presents a talk on Processing in Memory (PIM) Power and Thermal Challenges and Opportunities at the RESMIQ event as a part of the IEEE Circuits and Systems Society virtual seminar series. The talk addressed the Thermal/Power delivery challenges for PIM that are a result of the increased switching activities inherent to the moving of processing into the memory fabric, and exacerbated by the evolution towards 3D integration due to the slow-down of traditional Moore's law methods.