Microfabrication Fees and Reservations
IFAB Monthly Entrance Fees
IFAB operates with a combination of a base monthly user Entrance-Fee along with hourly equipment rates on select equipment. IFAB currently offers a single Full Facility Entrance Fee that allows users access to both Microfabrication and BioManufacturing. IFAB also offers a BioManufacturing ONLY Entrance-Fee. Users must recieve a Microfabrication Facility & Safety tour before they can access the Microfabrication equipment-stations, and receive a BioManufacturing Facility & Safety tour before accessing BioManufacturing equipment-stations. The Microfabrication Entrance Fee = $950/mo (we will soon be moving two two tiers of reduced monthly Microfabrication Entrance Fees along with a $/hr Equipment Fee).
→ All users must enter a Funding Account number (PTAO) in the IFAB Monthly Entrance Fee system every month they plan to use IFAB (external users should enter their name an institution)
Full Facility (Microfab+BioM) Entrance Fees
IFAB Microfabrication Sign-Up Calendars and select $/hr Equipment Fees
IFAB Microfabrication and BioManufacturing spaces and equipment are open to IFAB Full Facility Monthly Fee members.
Select equipment in BioManufacturing is offered on a $/hr basis and requires Sign-Up Calendar reservation. The remaining BioManufacturing equipment/stations are available without $/hr fee or Sign-Up reservation.
Select equipment in Microfabrication requires Sign-Up Calendar reservation (even if it does not have a $/hr charge for use). The select Microfabrication equipment requiring Sign-Up Calendar reservation is listed below, along with embedded IFAB SharePoint Sign-Up Calendar links.
→ All users must first read the instructions for filling in Calendar Sign-Up sheets: click-here
→ Users must be trained and staff-approved for use on all equipment
→ Click Here for BioManufacturing Fees and Sign-Up Calendars
Daily Sign-In Calendar
Microfabrication Reservation Sign-Up Calendars
LITHOGRAPHY
DIRECT WRITE & IMAGING
RAITH 150-TWO EBEAM DIRECT WRITE
MICROWRITER LASER DIRECT WRITE
FESEM (Zeiss Gemini-3 with EDS)
DEPOSITION
RF DIODE SPUTTER (single target)
LESKER MAGENTRON SPUTTER (open for use!)
AJA SPUTTER (superconducting-THz work)
SPUTTER-3 (superconducting-THz group)
TRI-4 (superconducting group)
DRY ETCHING
OXFORD PLASMALAB-100 CHLORINE ICP-RIE (has additional $10/hr LN2 charges)
OXFORD COBRA-300 FLUORINE SI ICP-RIE
WET PROCESSING
AU-PLATING (Mike Cyberey is point contact)
NI-PLATING (Mike Cyberey is point contact)
CRITICAL POINT DRYER (In south-east corner)
MISCELLANEOUS
RTA (Axic)
BRUKER GT-K OPTICAL PROFILER (for a > 1hr Sign-Up period)
SUSS WAFER BONDER (SUSS X8 high force-temp)