Microfabrication Fees & Reservation Calendars
IFAB Microfabrication Fees & Reservation Calendars
IFAB Monthly Entrance Fees
IFAB operates with a combination of a base monthly user Entrance-Fee along with hourly equipment rates on select equipment. IFAB currently offers a single Full Facility Entrance Fee that allows users access to both Microfabrication and BioManufacturing. IFAB also offers a BioManufacturing ONLY Entrance-Fee. Users must recieve a Microfabrication Facility & Safety tour before they can access the Microfabrication equipment-stations, and receive a BioManufacturing Facility & Safety tour before accessing BioManufacturing equipment-stations. The Microfabrication Entrance Fee = $950/mo (we will soon be moving two two tiers of reduced monthly Microfabrication Entrance Fees along with a $/hr Equipment Fee).
→ All users must enter a Funding Account number (PTAO) in the IFAB Monthly Entrance Fee system every month they plan to use IFAB (external users should enter their name an institution)
Full Facility (Microfab+BioM) Entrance Fees
IFAB Microfabrication Sign-Up Calendars and select $/hr Equipment Fees
IFAB Microfabrication and BioManufacturing spaces and equipment are open to IFAB Full Facility Monthly Fee members.
Select equipment in BioManufacturing is offered on a $/hr basis and requires Sign-Up Calendar reservation. The remaining BioManufacturing equipment/stations are available without $/hr fee or Sign-Up reservation.
Select equipment in Microfabrication requires Sign-Up Calendar reservation (even if it does not have a $/hr charge for use). The select Microfabrication equipment requiring Sign-Up Calendar reservation is listed below, along with embedded IFAB SharePoint Sign-Up Calendar links.
→ All users must first read the instructions for filling in Calendar Sign-Up sheets: click-here
→ Users must be trained and staff-approved for use on all equipment
→ Click Here for BioManufacturing Fees and Sign-Up Calendars
Daily Sign-In Calendar
Microfabrication Reservation Sign-Up Calendars
LITHOGRAPHY
DIRECT WRITE & IMAGING
DEPOSITION
RF Diode Sputter (single target)
AJA Sputter (superconducting-THz work)
Sputter-3 (superconducting-THz group)
Tri-4 (superconducting group)
DRY ETCHING
Oxford Chlorine ICP-RIE (has additional LN2 charges)
WET PROCESSING
Au-Plating (Mike Cyberey is point contact)
Ni-Plating (Mike Cyberey is point contact)
Critical Point Dryer (In south-east corner)
MISCELLANEOUS
Optical Profiler (for a > 1hr Sign-Up period)
Logitch PM5 Lapping-Polishing Tool